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电流密度对无氰镀银层性能的影响 预览

Effect of Current Density on the Performance of Cyanide-Free Silver Plating
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摘要 本实验采用硫代硫酸盐体系的镀银液,利用电沉积法在紫铜上制备银层。通过扫描电镜(SEM)、X射线衍射仪(XRD)、电化学工作站、抗硫实验、抗老化实验对镀层微观形貌、晶面取向、晶粒大小、耐蚀性、抗硫性、抗老化性能进行测试。结果表明,当电流密度为0.4 mA·cm^-2时,镀层结晶最致密,表面最平整,孔隙率最小,晶面取向为(111),自腐蚀电流密度为70.17 mA·cm^-2,自腐蚀电位为-0.2901 V,抗硫性及抗老化性能最优。 In this paper,silver coatings were prepared on copper by electrodeposition in thiosulfate silver plating bath. The microstructure,crystal orientation,grain size,corrosion resistance,sulfur resistance and anti-aging performance of the coatings were characterized by scanning electron microscopy(SEM),X-ray diffraction(XRD),electrochemical workstation,sulfur-resistant experiments and antiaging experiments. The results show that when the current density is 0.4 mA·cm^-2,the coating possesses the densest crystallization,the smoothest surface and the smallest porosity. The crystal plane orientation is(111),the self-corrosion current density is 70.17 mA·cm^-2 and the self-corrosion potential is-0.2901 V,the sulfur resistance and aging resistance are the best.
作者 宋超 刘丽颖 肖薇 陈秀华 SONG Chao;LIU Liying;XIAO Wei;CHEN Xiuhua(China Aviation Industry Changhe Aircraft Industry Co.,Ltd.,Jingdezhen 333000,China)
出处 《电镀与精饰》 CAS 北大核心 2019年第5期21-26,共6页 Plating & Finishing
关键词 无氰镀银 抗硫性 抗老化性 晶面取向 cyanide-free silver plating sulfur resistance aging resistance crystal orientation
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