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温度和频率对互连线信号完整性的影响 预览

Influence of temperature and frequency on signal integrity in IC interconnects
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摘要 针对VLSI中的互连线信号完整性问题,研究温度和频率对电阻、电感和电容的影响。在温度和频率的作用下,采用多节RLC模型,分别探讨温度和频率对互连线电学特性的影响,研究互连线的信号完整性问题。结果表明:在温度和频率的双重影响下,对温度和频率比较敏感的第5层互连线,在信号上升时间为0. 05 ns,负载是0. 1pF电容时,信号的延迟比没有考虑温度和频率影响时的延迟多121 ps;当负载是电阻时,延迟变化不大。温度对串扰的影响较小,频率对串扰的影响较大,在温度和频率的双重影响下,阻性负载时远端串扰变大,近端串扰变小,而容性负载时近端串扰和远端串扰都变小。 The influence of temperature and frequency on resistance,inductance,and capacitance of interconnects signal integrity in VLSI was studied. The electrical characteristics of interconnects is calculated. The signal integrity of interconnects was studied with a multi-sectional RLC model under the effect of temperature and frequency. The experiment showed that when the rise time of signal was 0. 05 ns and the load capacitance was 0. 1 pf,the delay of signal on the fifth layer interconnects,which was sensitive to temperature and frequency,was about 121 ps more than that in which temperature and frequency were not considered. For the resistance load,the delay varied slightly.Temperature had little influence on crosstalk,while frequency had much influence on it. When temperature and frequency were applied together,the far-end crosstalk became larger,while the near-end crosstalk became smaller for resistance load. For capacitance load,both far-end crosstalk and near-end crosstalk became smaller.
作者 魏建军 王振源 陈付龙 刘乃安 李晓辉 韦娟 WEI Jianjiu;WANG Zhenyuan;CHEN Fulong;LIU Naian;LI Xiaohui;WEI Juan(School of Telecommunications Engineering,Xidian University,Xi'an 710071,China;School of Mathematics and Computer Science,Anhui Normal University,Wuhu 241003,China)
出处 《哈尔滨工程大学学报》 EI CAS CSCD 北大核心 2019年第4期834-838,共5页 Journal of Harbin Engineering University
基金 国家自然科学基金项目(61572036) 陕西省自然科学基础研究计划(2017JM6052) 西安电子科技大学新教师创新基金项目(20199176405).
关键词 温度 频率 趋肤效应 延迟 串扰 信号完整性 互连线 阻性负载 容性负载 temperature frequency skin effect delay crosstalk signal integrity interconnect resistive load capacitive load
作者简介 通信作者:魏建军,男,副教授,E-mail:jjwei@xidian.edu.cn;陈付龙,男,教授,硕士生导师.
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