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Improving Strength of Carbon Fiber Grafted Carbon Nanotube Reinforced Thermoplastic Composites by 3D-Printed Molding 预览
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作者 Ruonan Wang Haihong Wu +2 位作者 Ziyue Guo Chuntai Liu Changyu Shen 《哈尔滨工业大学学报:英文版》 EI CAS 2019年第2期71-79,共9页
To improve the strength of carbon fiber(CF)reinforced Polycaprolactam(PA6)composites,controlled amounts of carbon nanotubes(CNTs)were grafted onto the surface of CF to prepare the hybrid reinforcement(HR).We used HR t... To improve the strength of carbon fiber(CF)reinforced Polycaprolactam(PA6)composites,controlled amounts of carbon nanotubes(CNTs)were grafted onto the surface of CF to prepare the hybrid reinforcement(HR).We used HR to fabricate laminate and H-sample to test the interfacial bonding strength(IBS)of the composites by means of a novel process called three-dimensional printed molding(3D-PM).By using the melt drop printing method,we measured the contact angles between PA6 and CF(without sizing)and between PA6 and HR.The IBS and the mechanical properties of the composites were obtained by the tensile test.The experimental result indicated that CF grafted by 0.25%weight fraction of CNT or more could develop a special microstructure similar to the micro-pits on the surface of CF,which improved the wettability of CF and PA6 due to the increased surface area and the roughness of CF.When the weight fraction of CNT reached 0.25%,the IBS increased by 41.8%,the tensile strength by 130%,and the interfacial shear strength(IFSS)by 238%.The interfacial dimple fracture was observed by Scanning Electron Microscope(SEM),which revealed that the composites were able to absorb more deforming energy before fracture.The modified surface microstructure of CF would prevent crack propagation at the interface and increase the mechanical properties of thermoplastic composites(TPCs). 展开更多
关键词 thermoplastic composites INTERFACIAL bonding STRENGTH INTERFACIAL shear STRENGTH 3D-printed MOLDING
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新市民城乡粘合催化作用间的因果关系及政策启示——基于SEM模型和1010份问卷调查数据 预览
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作者 朱振亚 汪阳春 《太原理工大学学报:社会科学版》 2019年第2期62-71,共10页
新市民在城乡一体化进程中具有粘合与催化作用。研究表明:新市民“情感粘性”“生活粘性”是其“工作粘性”“三个反哺催化促进”“四个带动催化促进”的“本因”,“情感粘性”“生活粘性”从根本上决定了新市民城乡“工作粘性”“三个... 新市民在城乡一体化进程中具有粘合与催化作用。研究表明:新市民“情感粘性”“生活粘性”是其“工作粘性”“三个反哺催化促进”“四个带动催化促进”的“本因”,“情感粘性”“生活粘性”从根本上决定了新市民城乡“工作粘性”“三个反哺催化促进”和“四个带动催化促进”作用的大小。“情感粘性”是第一本因,“生活粘性”是第二本因。触动新市民城乡粘合催化作用的总策略是设法提升新市民的城乡情感粘性和生活粘性。 展开更多
关键词 城乡一体化 新市民 粘合 催化促进
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节段预制胶接拼装桥梁在高速铁路中的应用 预览
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作者 赵伟 《价值工程》 2019年第11期126-128,共3页
节段预制胶接拼装简支梁是建造桥梁的一种方法,其原理是结合简支箱梁预制、架桥机架设、预应力混凝土构造、分段施工等方法综合而成,具有经济效益好、工效高、质量标准高、适用性强等特点。本文结合工程实例,介绍节段预制胶接拼装简支... 节段预制胶接拼装简支梁是建造桥梁的一种方法,其原理是结合简支箱梁预制、架桥机架设、预应力混凝土构造、分段施工等方法综合而成,具有经济效益好、工效高、质量标准高、适用性强等特点。本文结合工程实例,介绍节段预制胶接拼装简支梁的施工顺序及控制要点,为今后类似工程施工提供参考经验。 展开更多
关键词 高速铁路 桥梁 节段预制 胶接 拼装
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欧冶炉垂直胶带机胶带接头黏接方案分析 预览
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作者 田庄 彭银加 《橡塑技术与装备》 CAS 2019年第3期57-61,共5页
通过欧冶炉垂直胶带机胶带钢丝绳的搭接间距及搭接方式的计算和分析,接头长度的计算和计算机辅助工具的模拟,减少胶带接头处的部分钢丝绳根数,不影响胶带强度,并能够实现胶带接头方式从四阶搭接转换为三阶搭接。
关键词 胶带接头 黏接 方案分析
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Theoretical analyses of chemical bonding in terminal EThF2 (E = O, S, Se, Te) 预览
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作者 Yan-Li Li Xiao-Gen Xiong Hong-Tao Liu 《核技术:英文版》 SCIE CAS CSCD 2019年第5期1-8,共8页
Analyses of chemical bonding and geometric structures in species with chalcogen elements EThF2 (E = O, S, Se, Te) are performed by the density functional theory. Kohn–Sham molecular orbitals and Th–E bond lengths of... Analyses of chemical bonding and geometric structures in species with chalcogen elements EThF2 (E = O, S, Se, Te) are performed by the density functional theory. Kohn–Sham molecular orbitals and Th–E bond lengths of these species both indicate multiple bond character for the terminal chalcogen complexes. This is also confirmed by natural bond orbital analyses using the oneelectron density matrix generated by relativistic density functional calculations. Theoretical analyses indicate that electron donation from E to Th increases down the chalcogen group (O<S<Se<Te). These molecules can serve as examples of multiple bonding between actinide elements and selenium or tellurium. 展开更多
关键词 EThF2 Chemical BONDING Natural BOND ORBITAL (NBO)
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浅议PFMEA在海上风电叶片粘接工艺中的应用 预览
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作者 赵立岩 刘妍 +1 位作者 许有木 姜悦 《玻璃钢/复合材料》 CAS 北大核心 2019年第4期58-61,共4页
在海上风电叶片产品设计开发早期充分识别潜在失效原因并制定验证相应防范措施是开发风电叶片产品的重要措施本文介绍了 PFMEA 应用与海上风电叶片设计开发的实例通过分析潜在失效原因发现粘接胶涂胶尺寸设计与界面处理方式是风电叶片... 在海上风电叶片产品设计开发早期充分识别潜在失效原因并制定验证相应防范措施是开发风电叶片产品的重要措施本文介绍了 PFMEA 应用与海上风电叶片设计开发的实例通过分析潜在失效原因发现粘接胶涂胶尺寸设计与界面处理方式是风电叶片后缘粘接是否出现空腔、气泡等缺陷的关键影响因素并通过 NDT 无损探伤检测验证粘接胶涂胶工艺设计的可行性有效控制产品开发的风险. 展开更多
关键词 PFMEA 海上风电叶片 设计开发 粘接
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龈壁提升术在椅旁即刻全瓷微创修复中的临床研究 预览
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作者 袁晓琴 奂忠平 《巴楚医学》 2019年第1期41-44,共4页
目的:研究龈壁提升技术在椅旁即刻全瓷修复中的临床应用价值。方法:63例患者的74颗后牙牙体缺损(伴有邻面缺损达龈下水平,但没有破坏生物学宽度)分为两组进行修复,每组37颗牙,对照组为常规方法修复,实验组先采用龈壁提升提升,然后修复... 目的:研究龈壁提升技术在椅旁即刻全瓷修复中的临床应用价值。方法:63例患者的74颗后牙牙体缺损(伴有邻面缺损达龈下水平,但没有破坏生物学宽度)分为两组进行修复,每组37颗牙,对照组为常规方法修复,实验组先采用龈壁提升提升,然后修复牙体。2组均采用IPS e.max椅旁即刻全瓷微创修复,1年后进行临床随访。参照美国公共健康协会(USPHS)修正标准对74个IPS e.max CAD全瓷修复体进行临床效果评价并进行统计学分析。结果:两组修复体在边缘密合性、继发龋、形态匹配、颜色匹配性、修复体脱落、修复体崩裂方面均无统计学差异(均P>0.05);在牙龈健康方面,对照组达到A级标准的仅72.97%,实验组达到A级标准的有91.89%,两组差异有统计学意义(P<0.05)。结论:龈壁提升技术在椅旁即刻全瓷修复中,对维持牙龈健康有较好的临床效果。 展开更多
关键词 龈壁提升术 即刻全瓷修复 微创修复 可切削玻璃陶瓷 粘接
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Influence of Extrusion Speed on the Microstructure Evolution, Interface Bonding and Mechanical Response of Mg MB26/Al 7075 Composite Rod
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作者 Yu Chen Rui Zhang +11 位作者 Tao Zhou Li Hu Jian Tu Lai-Xin Shi Yan Zhi Li-Wei Lu Qiang Chen Ben-Hong Liao Lei Liu Wen-Jun Ge Jing Xiao Ming-Bo Yang 《金属学报:英文版》 SCIE EI CAS CSCD 2019年第2期253-262,共10页
The Mg MB26/Al 7075 composite rod,in which Mg MB26 serves as the sleeve and Al 7075 serves as the core,is fabricated via the process of co-extrusion.The influence of extrusion speed on the microstructure evolution,int... The Mg MB26/Al 7075 composite rod,in which Mg MB26 serves as the sleeve and Al 7075 serves as the core,is fabricated via the process of co-extrusion.The influence of extrusion speed on the microstructure evolution,interface bonding and mechanical response of the Mg MB26/Al 7075 composite rod is investigated.The results show that the typical extrusion texture of Mg sleeve does not change during co-extrusion;however,the average grain size in the Mg sleeve slightly changes from 1.57 lm in the case of extrusion speed of 0.3 mm/s to 2.78 lm in the case of extrusion speed of2.1 mm/s.The thickness of interface transition layer increases significantly from 5.5 to 50 lm,and therefore,the interface bonding becomes deteriorative with increasing extrusion speed;in particular,many cavities emerge in the case of 1.2 and2.1 mm/s. 展开更多
关键词 MB26/7075 COMPOSITE ROD EXTRUSION SPEED Microstructure evolution Interface BONDING Mechanical response
Investigation of the factors affecting the limit of detection of laser-induced breakdown spectroscopy for surface inspection
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作者 Tadatake SATO Kenichi TASHIRO +2 位作者 Yoshizo KAWAGUCHI Hideki OHMURA Haruhisa AKIYAMA 《等离子体科学与技术:英文版》 SCIE EI CAS CSCD 2019年第3期174-181,共8页
Laser-induced breakdown spectroscopy(LIBS)was examined to detect a trace substance adhered onto Al alloys for the surface inspection of materials to be adhesively bonded.As an example of Si contamination,silicone oil ... Laser-induced breakdown spectroscopy(LIBS)was examined to detect a trace substance adhered onto Al alloys for the surface inspection of materials to be adhesively bonded.As an example of Si contamination,silicone oil was employed and sprayed onto substrates with a controlled surface concentration.LIBS measurements employing nanosecond UV pulses(λ=266 nm)and an off-axis emission collection system with different detecting heights were performed.Because surface contaminants are involved in the plasma formed by laser ablation of the substrates,the relative contribution of the surface contaminants and the substrates to the plasma emission could be changed depending on the conditions for plasma formation.The limit of detection(LOD)was evaluated under several detecting conditions for investigating the factors that affected the LOD.A significant factor was the standard deviation values of signal intensities obtained for the clean substrates.This value varied depending on the measurement conditions.For the Al alloy(A6061),the smallest LOD obtained was 0.529μg·cm^-2.Furthermore,an improved LOD(0.299μg·cm^-2)was obtained for the Al alloy with a lower Si content. 展开更多
关键词 LASER-INDUCED BREAKDOWN spectroscopy adhesive BONDING SURFACE CONTAMINATION detection pre-bond SURFACE inspection
GB/T 35452—2017《再生粘合软质聚氨酯泡沫塑料》介绍和解读 预览
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作者 钱洪祥 吴昊 倪新星 《聚氨酯工业》 北大核心 2019年第2期41-44,共4页
综述了再生粘合软质聚氨酯泡沫的特点、应用、生产工艺、质量影响因素和发展情况,介绍了国家标准GB/T35452 2017《再生粘合软质聚氨酯泡沫塑料》的立项背景、制定原则、制定过程和标准技术内容,并与相关国际标准进行了对比。
关键词 软质泡沫塑料 国家标准 再生 粘合 海绵 聚氨酯
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Improved tabledng behavior of paracetamol in the presence of polyvinylpyrrolidone additive: Effect of mixing conditions
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作者 Ayuk Agbor Rose Waseem Kaialy 《中国颗粒学报:英文版》 SCIE EI CAS CSCD 2019年第2期9-18,共10页
Monoclinic paracetamol (PA) is notorious as a poorly compactible model drug. Polyvinylpyrrolidone (PVP) is a polymer that can act as an effective binder to improve the mechanical properties of PA. It is surprising how... Monoclinic paracetamol (PA) is notorious as a poorly compactible model drug. Polyvinylpyrrolidone (PVP) is a polymer that can act as an effective binder to improve the mechanical properties of PA. It is surprising however that the role of mixing conditions on the physicochemical and mechanical properties of PA-PVP mixtures has not been reported previously. The results of this work showed that PA-PVP mixtures containing 5%(w/w) PVP prepared using high energy mixing conditions had considerably smaller particle size distributions and higher cohesivities than mixtures prepared using low energy mixing conditions. Solid-state analysis did not detect any change in the monoclinic crystalline form of PA after mixing with PVP. The following rank order of tabletability for PA-PVP mixtures was obtained according to the mixing condition: low shear-medium shear< dry high shear< wet high shear< high-speed homogenization. A higher level of hydrogen bonding was detected in the mixtures prepared via high energy mixing conditions than in those prepared using low energy mixing conditions. Mixing is therefore a critical process that needs to be optimized during the preparation of in teractive mixtures for tableting. 展开更多
关键词 Direct compression INTERACTIVE mixtures Hydrogen bonding Mechanical PROPERTIES PHYSICOCHEMICAL PROPERTIES Tableting
有轨电车头罩粘接结构的有限元仿真分析 预览
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作者 赵亚峰 杭翔 +2 位作者 韩东旭 李刚 陈锡嘉 《粘接》 CAS 2019年第2期43-46,共4页
对某型号有轨电车头罩部位的粘接结构进行了有限元仿真分析,按照DIN6701-3:2015-12《轨道交通车辆及车辆部件的粘接-第3部分:轨道交通车辆粘接接头的设计及验证指导手册》标准的要求,得出了该粘接结构在不同载荷工况下的应力应变情况,... 对某型号有轨电车头罩部位的粘接结构进行了有限元仿真分析,按照DIN6701-3:2015-12《轨道交通车辆及车辆部件的粘接-第3部分:轨道交通车辆粘接接头的设计及验证指导手册》标准的要求,得出了该粘接结构在不同载荷工况下的应力应变情况,并与对应的载荷极限进行比对,从而系统验证了该粘接接头在整个产品寿命周期内的可靠性。基于仿真结果对于应力集中的粘接部位给出了相应的结构优化建议。 展开更多
关键词 有轨电车 粘接 仿真
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牙科氧化锆陶瓷粘接材料的研究进展 预览
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作者 王辰 《粘接》 CAS 2019年第2期47-51,共5页
对氧化锆陶瓷粘接专用的树脂粘接剂与偶联剂的种类、成分及研究进展进行了综合评述,为临床上氧化锆修复体粘接材料的选择提供依据。
关键词 有机硅树脂 粘接技术 优化
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Dissipative Particle Dynamics Simulation on Bonding Reaction Between Surface Modified Nanoparticles
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作者 唐伟 陈鹏 +5 位作者 FENG Xiaoshuang XIA Ru QIAN Jiasheng CAO Ming SU Lifen MIAO Jibin 《武汉理工大学学报:材料科学英文版》 SCIE EI CAS 2019年第1期91-97,共7页
A simulation study was carried out by using dissipative particle dynamics(DPD) method to explore the effects of properties of coating chains, such as length, density, rigidity of polymer chains, as well as the distanc... A simulation study was carried out by using dissipative particle dynamics(DPD) method to explore the effects of properties of coating chains, such as length, density, rigidity of polymer chains, as well as the distance between nanoparticles on bonding reaction of coating chains grafted onto nanoparticles. The results show that bonding ratios of coated chains strongly depend on the length and density of coating chains. For nanoparticles with different coating densities, the optimum chain length for bonding reaction are varied. The rigidity of coating chains exhibits vigorous effects on bonding reaction that highly depends on chain lengths. DPD simulation can be used to study the bonding reaction between coated nanoparticles, which may help experimental synthesis of nanocomposites with excellent properties. 展开更多
关键词 DISSIPATIVE particle dynamics(DPD) BONDING REACTION surface modified NANOPARTICLES coating CHAINS
Improvement on the interface properties of p-GaAs/n-InP heterojunction for wafer bonded four-junction solar cells
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作者 Mengyan Zhang Tao Ning +2 位作者 Jie Chen Lijie Sun Lihua Zhou 《材料科学技术学报:英文版》 SCIE EI CAS CSCD 2019年第3期330-333,共4页
The p-GaAs/n-InP heterojunction was fabricated by direct wafer bonding technology. The optimized atomic level contact between GaAs and InP is critical for getting good ohmic contact and removing the bubbles or voids a... The p-GaAs/n-InP heterojunction was fabricated by direct wafer bonding technology. The optimized atomic level contact between GaAs and InP is critical for getting good ohmic contact and removing the bubbles or voids at the interface, which is helpful to enhance the efficiency of wafer bonded multi-junction solar cells. Through the surface megasonic cleaning and the plasma treatment, we have achieved the high quality bonding interface without bubbles or voids and with interface resistivity of about 0.1 ohms/cm~2. A GaInP/GaAs//InGaAsP/InGaAs 4-junction solar cell was prepared with the high efficiency of 34.4%(AM0)at 1 sun. 展开更多
关键词 Solar cells WAFER bonding INTERFACE properties HETEROJUNCTION
Partially decoupling and collar bonding of the encapsulated rebar rockbolts to improve their performance in seismic prone deep underground excavations 预览
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作者 Reza Masoudi Mostafa Sharifzadeh Masoud Ghorbani 《矿业科学技术学报:英文版》 CSCD 2019年第3期409-418,共10页
Rockbolt is widely employed all over the world as an effective ground reinforcement element in order to secure the underground workplaces.Ordinary encapsulated rebar or rebar rockbolt is most popular and commonly used... Rockbolt is widely employed all over the world as an effective ground reinforcement element in order to secure the underground workplaces.Ordinary encapsulated rebar or rebar rockbolt is most popular and commonly used as reinforcement in a ground support system because of its accessibility,cost effectiveness and easy practicability.Reinforcement elements in a seismic condition such as rock burst have to dissipate the energy release of the dynamic impact via their deformation and ultimate load capacity,knowing that the former is more important.In other words,achieving early stiff behaviour along with large deformation capacity in rockbolts are the goals for new development in rock reinforcement.Yielding rockbolts are expensive while some of them have large deformation capability with low ultimate load capacity.In this paper,modifications were made on encapsulation of rebar rockbolts to utilise it effectively as a yielding reinforcement in seismic conditions.Applying a sufficient decoupled length in the shank of rebar rockbolts which industry has regularly been using to control the bulking of the stress fractured ground,improves the deformation capacity of the bolt.Additionally,leaving a collar bonding underneath of the bearing pad and plate removes the weaknesses of the head anchorage of rockbolt.Therefore the dynamic performance of the bolt is improved by these easily applicable modifications.The behaviour and performance of encapsulated rockbolts have been discussed first,then the effects of modifications are illustrated.The proposed modification of the rebars is not only cost effective but also easy to apply in the field and improves the performance of reinforcements in seismic prone zones. 展开更多
关键词 Rockbolt Tunnel SUPPORT COLLAR BONDING SEISMIC rock SUPPORT Tunnelling
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团簇Co3NiB2的成键分析与电子性质 预览
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作者 秦渝 方志刚 +1 位作者 张伟 李历红 《辽宁科技大学学报》 CAS 2019年第1期40-47,共8页
采用密度泛函理论方法,对团簇Co3NiB2在B3LYP/Lan12dz水平下优化后得到的12种稳定构型的成键和电子性质两方面进行分析,得到以下结论:团簇Co3NiB2优化构型中各成键的成键强度由大到小为:金属与非金属之间成键>金属之间成键>非金... 采用密度泛函理论方法,对团簇Co3NiB2在B3LYP/Lan12dz水平下优化后得到的12种稳定构型的成键和电子性质两方面进行分析,得到以下结论:团簇Co3NiB2优化构型中各成键的成键强度由大到小为:金属与非金属之间成键>金属之间成键>非金属之间成键;各成键对团簇Co3NiB2稳定性贡献由大到小为:金属与非金属之间成键>金属之间成键>非金属之间成键;单帽四棱锥构型的电子主要是由Ni原子流向Co原子;单帽三角双锥与四棱双锥构型的电子均由B原子流向Co原子和Ni原子;在五棱锥构型中,电子由Co原子和Ni原子流向B原子。 展开更多
关键词 团簇Co3NiB2 成键 电子性质 密度泛函理论
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团簇Mn3BP成键及磁性 预览
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作者 周帅 方志刚 +4 位作者 陈林 崔远东 李历红 秦渝 马填琪 《辽宁科技大学学报》 CAS 2019年第1期54-62,共9页
为对原子簇Mn3BP的成键方式及其磁学特性进行分析,从轨道杂化角度研究其成键方式,从电子结构角度研究其磁性。研究表明:除构型5(4)、2(2)和4(2)外,其余构型B、P原子间均存在s-s和p-p杂化;p-d-p-p和p-p-p强杂化是导致各构型Mn-P和Mn-B成... 为对原子簇Mn3BP的成键方式及其磁学特性进行分析,从轨道杂化角度研究其成键方式,从电子结构角度研究其磁性。研究表明:除构型5(4)、2(2)和4(2)外,其余构型B、P原子间均存在s-s和p-p杂化;p-d-p-p和p-p-p强杂化是导致各构型Mn-P和Mn-B成键较强的原因之一。结构相似的团簇构型,其态密度分布及在各处的贡献也相近。团簇的磁性主要由Mn-3d轨道成单电子贡献。研究发现,团簇构型的s轨道的电子分布在能量0eV附近出现了电子自旋状态的转变。非金属原子B、P使团簇的磁性降低,四重态构型的磁性均高于二重态。 展开更多
关键词 团簇Mn3BP 成键 态密度 磁性
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氧化锆陶瓷粘接前表面处理方法的研究进展 预览
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作者 王辰 《粘接》 CAS 2019年第3期33-36,54共5页
对机械打磨与空气喷砂、摩擦化学硅涂层、高温化学硅涂层、蚀刻、激光照射、等离子喷涂及其他涂层技术对氧化锆陶瓷粘接前表面处理的优缺点进行了综述,展望了在临床应用前景。
关键词 氧化锆陶瓷 表面处理 粘接
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The combined effects of grain and sample sizes on the mechanical properties and fracture modes of gold microwires
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作者 H.K.Yang K.Cao +5 位作者 Y.Han M.Wen J.M.Guo Z.L.Tan J.Lu Y.Lu 《材料科学技术学报:英文版》 SCIE EI CAS CSCD 2019年第1期76-83,共8页
Hall-Petch relation was widely applied to evaluate the grain size effect on mechanical properties of metallic material. However, the sample size effect on the Hall-Petch relation was always ignored. In the present stu... Hall-Petch relation was widely applied to evaluate the grain size effect on mechanical properties of metallic material. However, the sample size effect on the Hall-Petch relation was always ignored. In the present study, the mechanical test and microstructure observation were performed to investigate the combined effects of grain and sample sizes on the deformation behaviors of gold microwires. The polycrystalline gold microwires with diameter of 16 ?m were annealed at temperatures from 100°C to 600°C, leading to different ratios(t/d) of wire diameter(t) to grain size(d) from 0.9 to 16.7. When the t/d was lower than 10, the yield stress dropped fast and deviated from the Hall-Petch relation. The free-surface grains played key role in the yield stress softening, and the volume fraction of free-surface grains increased with the t/d decreasing. Furthermore, the effects of t/d on work-hardening behaviors and fracture modes were also studied. With t/d value decreasing from 17 to 3.4, the samples exhibited necking fracture and the dislocation pile-ups induced work-hardening stage was gradually activated.With the t/d value further decreasing(t/d < 3.4), the fracture mode turned into shear failure, and the work-hardening capability lost. As the gold microwire for wire bonding is commonly applied in the packaging of integrated circuit chips, and the fabrication of microwire suffers multi-pass cold-drawing and annealing treatments to control the grain size. The present study could provide instructive suggestion for gold microwire fabrication and bonding processes. 展开更多
关键词 GOLD MICROWIRE Wire BONDING Tensile testing GRAIN size HALL-PETCH relationship
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